Pace TF2800 Bga and Smd Repair SystemStock No : 8007-0582

Konvansiyonel rezistanslı ısıtma teknolojisi, çeşitli BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 ve diğer alt sonlandırılmış bileşenleri takmak ve çıkarmak için konvektif yeniden işleme istasyonlarında yıllardır başarıyla kullanılmaktadır. Bununla birlikte, günümüzün son derece yüksek termal kütle panoları, ultra ince hatve bileşenleri ve zorlu üretim yeniden işleme ortamları, her zamankinden daha fazla proses kontrolü, termal performans ve daha hızlı üretim gerektirir.

PACE'in TF 2800 BGA / SMD'sini girin Rework Sistemi. Çığır açan, patent bekleyen Endüktif-Konveksiyonlu Isıtma Teknolojisi ile TF 2800'ün üst taraf ısıtıcısı, neredeyse güvenli ve hızlı lehim bağlantısı yeniden akışı için birkaç saniye içinde hedef sıcaklığa ulaşır herhangi bir bileşen yükleme veya kaldırma uygulaması.

Power Requirements	120 VAC, 50-60Hz (requires 20 A supply)|| 230 VAC, 50-60Hz (requires 10 A supply); 1600W maximum
Dimensions	737mm (29) H x 1118mm (44) W x 965mm (38) D
Weight (Without Computer)	90kg (200lbs)
Top-side Heater	Inductive-Convection Heater, 300 Watts
Bottom Side Heater	Medium/Long wave IR, 1900 Watts; 405mm (16) x 405mm (16) || (1 x 1000 Watts 6 x 150 Watts)
Bottom Heater Adjustable Height	Can be raised up to 38mm (1.5) closer to the PCB
Active Cooling Capability	Offers swift, yet controlled component/PCB cooling, directly through the nozzle
High Sensitivity Vacuum Pick	Counterweight balanced with an optical sensor and precision high temperature linear ball bearings (includes 7 picks)
Precision Placement Capability	Placement system utilizes a stepper motor and position encoding for precise movement
Placement Accuracy	28μm (.0011) accuracy
Integrated Board Support Beam	2 standard supports, 1 x support wand 1 x fixed center height adjustment, prevents PCBs from sagging or warping during rework and is extremely adjustable to clear parts on bottom of PCB.
Temperature Setting Range	Top Heater: 100˚ to 328˚C (212˚ - 624˚F); Bottom Heater: 100˚ to 221˚C (212˚ - 430˚F)
Max PCB Size	Maximum: 610mm x 610mm (24 x 24); Minimum: N/A arms close down completely
Max/Min Component Size	Maximum: 65mm (2.5) x 65mm (2.5); Minimum: 1mm Sq.
Thermocouple Inputs	Four (4) thermocouple inputs insure accurate profile development and real-time monitoring (includes 2 K-type thermocouples)
High Definition Optical Alignment	Vision Overlay System (VOS) with High Definition 1080p color camera
Vision Overlay System (VOS)	Contains integrated frame grabber and dichroic beam-splitting prism with independantly controlled LED lighting
VOS Zoom Capability	Up to 240x zoom capability, with Stable Zoom and image stabilization
Quad-Field Imaging	Allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification
Single Axis Operation	All operations are complete in a single axis, eliminating risk of component movement after placement/reflow
Auxiliary Cooling Fan	Standard
Software	Intuitive, user-friendly, Windows software guides operators through profile development and execution
Computer System	Windows 10 PC, with wireless mouse and keyboard
Video Monitor	607mm (24) wide screen flat panel monitor (includes Monitor Arm Mounting Kit)
Maximum Airflow	Self contained pump, PC controlled, adjustable up to 30 SLPM
Component Nests	Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Unique component holding system for parts under 5mm Sq.
Heat Focusing, Vented Nozzles	5 nozzles included; over 90 nozzles available
Flux Application Plate	Included; allows for automated flux dipping
Stencils/Solder Paste Application	Over 145 stencil kits are optionally available (requires Universal Bracket Kit) and are integrated into the installation process
PV-65 Pik-Vac Vacuum Wand	Included; provides a manual vacuum pick-up capability for handling SMDs, with 15 minute auto-off feature
Warranty	One Year Limited Warranty